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Sharma, S. V.
- Characterization and Mitigation of Electro-Static Bonding Failures in Microsensors
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Authors
Affiliations
1 Systems Engineering Group, ISRO Satellite Centre, IN
1 Systems Engineering Group, ISRO Satellite Centre, IN
Source
ICTACT Journal on Microelectronics, Vol 3, No 1 (2017), Pagination: 345-348Abstract
Electrostatic bonding between glass and silicon is carried out in micro sensor devices to achieve higher bond strength thus eliminating the requirement of adhesives. This can also be useful in providing hermiticity and results in reliable operation of the micro sensor devices. Practically the sensor performance is prone to long term drift mainly due to process associated with the assembly and packaging. Bonding is the one of the critical process in micro sensor and generally sensor stability is dependent on this process along with other packaging material and methodology. Bond strength is one of the critical parameters to find out the quality of bond and the same is quantified and compared for different conditions. This article details electrostatic bonding process, various parameters responsible for the reliable bonding, modelling and characterization along with simple methodology to achieve higher bond strength.Keywords
Bonding, Micro-Sensor, Anodic, Electrostatic, Sensor, Bond Strength.
References
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- Link Margin for Wireless Radio Communication Link
Abstract Views :223 |
PDF Views:4
Authors
Affiliations
1 Systems Engineering Group, ISRO Satellite Centre, Bangalore, IN
1 Systems Engineering Group, ISRO Satellite Centre, Bangalore, IN
Source
ICTACT Journal on Communication Technology, Vol 8, No 3 (2017), Pagination: 1574-1581Abstract
The systematic evaluation of the link budget calculation for the satellite and terrestrial communication is presented in this article. Communication link between the satellite and earth station is dependent on various propagation and associated losses which are either constant or vary with weather conditions. Role of receiver noise, antenna pointing mechanism, atmospheric effects, slant height, interferences, bit error rate on the link margin are detailed in this article. Various equations for link budget calculation and a comparative table at various frequency bands are shown in this article which is useful for predicting link margin of LEO, GEO and Deep space missions. Tele-command, telemetry and ranging link margin at various frequencies are presented and budget analysis at Ka-band frequency performed.Keywords
Link Budget, Margin, Atmospheric Effects, Noise, Propagation Losses, Uplink, Downlink.References
- D.M. Pozar, “Microwave Engineering”, John Wiley and Sons, 2010.
- S.K. Sharama, S. Chatzintos and B. Otersten, “In-line Interference Mitigation Techniques for Spectral Coexistence of GEO and NGEO Satellites”, International Journal of Satellite Communications, Vol. 34, No. 1, pp. 11-39, 2016.
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- Semi-Conductor Ambience For Building Self-Reliance in the Country
Abstract Views :172 |
PDF Views:0
Authors
Affiliations
1 Systems Engineering Group, ISRO Satellite Centre, Bangalore, IN
1 Systems Engineering Group, ISRO Satellite Centre, Bangalore, IN
Source
ICTACT Journal on Microelectronics, Vol 3, No 4 (2018), Pagination: 488-493Abstract
In the present era of importing chips are the major bottlenecks in attaining self-reliance for the strategic sector in the country. The existing trend of chip development at nanometer geometry needs huge and constant capital investment which is not possible in present scenario. The requirement of the country is to have maximum and efficiently utilization of available technology which can cater for achieving self-reliance in strategic sector requirements. Further effort towards miniaturization and multiple operations using single chip solution can put country on the world map. The major bottlenecks in the country are the fabrication and realization of such systems which can leads to self-reliance in the country. In spite of the whole hearted support of the government still we are far behind in achieving self-sufficiency with the available technology node. Some of the industries closed their manufacturing operations and remaining are not performing as per expectations. In spite of leaders in chip design and flooded with best talent still we are way behind self-reliance in the area of semiconductor in spite of huge investments. This article will bring out the foundry complexity, present scenario in the country, corrective methodology, and suggestive framework for creating semiconductor ambience in the country.Keywords
Semiconductor Industry, Self-Reliance, Technology Upgradation, Integrated Circuits.References
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- H. Kushwah and A. Seth, “Future of Semiconductor Fabrication Industries in India-Opportunities and Challenges”, International Journal of Research in Engineering and Technology, Vol. 4, No. 8, pp. 72-75, 2015.
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- Kamaljeet Singh, “Major Steps in Thin Film Process and Overview of Various Resources”, Antriksh Gyan Sarita-Annual Magazine, Vol. 1, pp. 84-89, 2015.
- Kamaljeet Singh and A.V. Nirmal, “Technological Advancement by Bridging the gap between Industry and Academia”, Proceedings of 5th International Conference on MOOCs,Innovation and Technology in Education, pp. 11-15, 2017.
- Kamaljeet Singh and A.V. Nirmal, “Reliability Aspects in RF-MEMS Circuits for Space Applications”, Journal of Engineering and Technology, Vol. 4, No. 6, pp. 1-11, 2016.
- Kamaljeet Singh and A.V. Nirmal, “Growth Model of ISRO Growth in Indian Perspective”, Proceedings of 5th International Conference on Emerging Trends in Engineering, Technology, Science and Management, pp. 563-568, 2017.
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